论文标题
在微米尺度上的原位稳定裂纹生长的HR-EBSD分析
HR-EBSD analysis of in situ stable crack growth at the micron scale
论文作者
论文摘要
了解微结构特征的局部断裂性。在复杂的载荷条件下，在微观尺度上的脆性包裹物，涂料和界面对于材料的微观结构设计至关重要。在这项研究中，已经制定了一种新的方法，将弹性能量释放速率分解为对三维应力强度因子的J积分评估直接从裂纹场的弹性变形梯度张力量的实验测量直接通过原位（角度）高（角度）分辨率分辨率电子后粒子衍射（HR-EBSD）。提出了一个准静态裂纹的示例研究，该裂纹倾向于观察到的表面，并在（001）单晶硅晶片中传播了低指数{hkl}平面。
Understanding the local fracture resistance of microstructural features. such as brittle inclusions, coatings, and interfaces at the microscale under complex loading conditions is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.
