论文标题

LCLS-II-HE验证冷冻模块腔的血浆清洁

Plasma Cleaning of LCLS-II-HE verification cryomodule cavities

论文作者

Giaccone, Bianca, Berrutti, Paolo, Martinello, Martina, Posen, Sam, Cravatta, Andrew, Netepenko, Alexandr, Arkan, Tug, Grassellino, Anna, Hartsell, Brian, Kaluzny, Joshua, Penhollow, Andrew, Gonnella, Dan, Ross, Marc, Maniscalco, James, Fuerst, Joel, Hays, Greg, Doleans, Marc

论文摘要

血浆清洁是一种可以在冰冻模块中原位应用于超导射频(SRF)腔中的技术,以降低其田间发射水平。我们开发了LINAC相干光源II(LCLS-II)腔的技术,并在本文中介绍了等离子体加工在LCLS-II高能(HE)验证冷冻模块(VCM)中的完整开发和应用。我们在VCM上验证了血浆处理程序,在该CM的八个腔中完全处理了四个,这表明蛀牙性能是在加速场和质量因子方面保留的。将等离子体处理应用于此干净,记录的打破冷冻模块还表明,在弦中没有引入污染物,将VCM场发射保持无污染物,直至每个腔所达到的最大场。我们还发现,等离子体处理消除了通常在MP带场范围内经常观察到的多乳酸(MP)诱导的淬火。这表明可以在CMS中使用等离子体处理来减轻现场排放和多重分流,从而大大减少了冷冻模块的测试时间,LINAC调试时间和成本并提高了加速器的可靠性。

Plasma cleaning is a technique that can be applied in superconducting radio-frequency (SRF) cavities in situ in cryomodules in order to decrease their level of field emission. We developed the technique for the Linac Coherent Light Source II (LCLS-II) cavities and we present in this paper the full development and application of plasma processing to the LCLS-II High Energy (HE) verification cryomodule (vCM). We validated our plasma processing procedure on the vCM, fully processing four out of eight cavities of this CM, demonstrating that cavities performance were preserved in terms of both accelerating field and quality factor. Applying plasma processing to this clean, record breaking cryomodule also showed that no contaminants were introduced in the string, maintaining the vCM field emission-free up to the maximum field reached by each cavity. We also found that plasma processing eliminates multipacting (MP) induced quenches that are typically observed frequently within the MP band field range. This suggests that plasma processing could be employed in situ in CMs to mitigate both field emission and multipacting, significantly decreasing the testing time of cryomodules, the linac commissioning time and cost and increasing the accelerator reliability.

扫码加入交流群

加入微信交流群

微信交流群二维码

扫码加入学术交流群,获取更多资源