论文标题
超高真空包装和量子设备的表面清洁
Ultrahigh Vacuum Packaging and Surface Cleaning for Quantum Devices
论文作者
论文摘要
我们描述了用于超导量子芯片或其他表面敏感量子设备的超高真空包装（UHV）包装的设计，实现和性能。 UHV加载过程允许退火，超紫光照射，离子铣削和量子设备的表面钝化，然后将其密封到测量包装中。该包装在转移到低温温度期间，通过用钛金属蛋白层进行积极的效果保留真空。我们表征了系统的处理能力，并目前测量了通量可调节量子位，平均t $ _1 = 84〜μ $ s和t $^{echo} _2 = 134〜μ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ S将这些样品加载到UHV-ackage中的底部负载稀释冰箱中。
We describe design, implementation and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows for annealing, ultra-violet light irradiation, ion milling and surface passivation of quantum devices before sealing them into a measurement package. The package retains vacuum during the transfer to cryogenic temperatures by active pumping with a titanium getter layer. We characterize the treatment capabilities of the system and present measurements of flux tunable qubits with an average T$_1=84~μ$s and T$^{echo}_2=134~μ$s after vacuum-loading these samples into a bottom loading dilution refrigerator in the UHV-package.
