论文标题
STT-MRAM测试的调查:故障机制,故障模型和测试
Survey on STT-MRAM Testing: Failure Mechanisms, Fault Models, and Tests
论文作者
论文摘要
作为最有希望的新出现的非易失性记忆(NVM)技术之一,自旋转移磁性随机访问记忆(STT-MRAM)由于多种功能,例如高密度,零备用泄漏和几乎无限的耐力,引起了重大的研究关注。但是,在STT-MRAM商业化之前,需要一种高质量的测试解决方案。在本文中,我们介绍了所有STT-MRAM故障机制:制造缺陷,极端过程变化,磁耦合,STT转换随机性和热波动。所得的故障模型包括永久性故障和瞬态故障,并进行了讨论。此外,还涵盖了文献中提出的有限的测试算法和设计算法(DFT)设计。显然,STT-MRAMS的测试解决方案远非建立良好,尤其是在考虑十亿(DPPB)水平的有缺陷时。我们在三个级别上提出了STT-MRAM测试主题的主要挑战:故障机制,故障建模和测试/DFT设计。
As one of the most promising emerging non-volatile memory (NVM) technologies, spin-transfer torque magnetic random access memory (STT-MRAM) has attracted significant research attention due to several features such as high density, zero standby leakage, and nearly unlimited endurance. However, a high-quality test solution is required prior to the commercialization of STT-MRAM. In this paper, we present all STT-MRAM failure mechanisms: manufacturing defects, extreme process variations, magnetic coupling, STT-switching stochasticity, and thermal fluctuation. The resultant fault models including permanent faults and transient faults are classified and discussed. Moreover, the limited test algorithms and design-for-testability (DfT) designs proposed in the literature are also covered. It is clear that test solutions for STT-MRAMs are far from well established yet, especially when considering a defective part per billion (DPPB) level requirement. We present the main challenges on the STT-MRAM testing topic at three levels: failure mechanisms, fault modeling, and test/DfT designs.